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Product

Bonding Line

Information

Advantages:

1. Automatic crack detection and appearance dimension detection after silicon rod feeding.
2. The automation of stick wire can be integrated with only one person regularly loading silicon bars.
3. Optimize the adhesive coating process without the need for tedious tape adhesion and tearing.
4. Highly integrated design, automatic feeding detection line for plastic sheets added.
5. Professional performance cleaning machine, effectively eliminating high-pressure cleaning machines.
6. Intelligent production line, real-time display on wireless large screen, and seamless integration with factory level MES (intelligent linkage between vertical library and slicer).

Parameters:

Production capacity≥850 /day (specific production capacity depends on actual site layout).
Counterweight, crystal support, resin plate centering, crystal stick adhesive offset ≤1mm Rod-drop rate 0%.
Fault rate≤0.1%, average time between failures≥168h, fault handling time less than 90min.
*The above parameters are subject to the actual product.

Applications:

Apply adhesive, cure and bond the incoming silicon rod with tray and resin board, and use it for cutting when leaving the warehouse.

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